EP3C25F324I7 vs EP3C25F324C8 Comparison
Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C25F324C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324I7 | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.80 | $23.10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | β |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | β |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | β |
| Maximum User I/O | 215 | β |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm CMOS, SRAM-based |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | β |
| Operating Junction Temperature | -40 Β°C to +100 Β°C (industrial) | β |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | β |
| RoHS Status | Compliant | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Logic Elements | β | 24,624 LE |
| Logic Array Blocks | β | 1,539 LABs |
| Embedded Multipliers | β | 66 (18 x 18) |
| User I/Os | β | 215 |
| Core Voltage | β | 1.2 V |
| Speed Grade | β | 8 (commercial) |
| Operating Temperature | β | 0 Β°C to +85 Β°C (commercial) |
| Maximum Internal Clock | β | 402 MHz |