EP3C40F780C6N vs EP3C40F780C7 Comparison
Detailed side-by-side comparison of EP3C40F780C6N by Intel and EP3C40F780C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C6N | EP3C40F780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $172.00 | $139.50 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | β |
| Embedded Memory Bits | 1,161,216 | β |
| Embedded Memory (Kbytes) | 113 | β |
| M9K Memory Blocks | 126 | β |
| Logic Array Blocks (LABs) | 4,065 | β |
| Maximum User I/O Pins | 535 | β |
| PLLs | 4 | β |
| Process Technology | 60 nm CMOS | 60 nm TSMC low-power CMOS |
| Core Voltage | 1.2 V | β |
| Speed Grade | 6 (commercial) | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Package | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F780) |
| Package Dimensions | 29 x 29 mm | 29 x 29 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Package Height | 2.6 mm | β |
| Mounting Type | Surface Mount (FBGA) | β |
| Lead Free | Yes | β |
| Configuration Method | SRAM, JTAG via USB-Blaster | β |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | β | 39,600 |
| Number of Logic Cells | β | 39,600 |
| Total Memory Bits | β | 1,161,216 bits |
| Embedded 18x18 Multipliers | β | 126 |
| Number of PLLs | β | 4 |
| User I/O Count | β | 535 |
| I/O Banks | β | 8 |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.2 V to 3.3 V |
| Configuration | β | Active Serial / Passive Parallel (JTAG) |
| MSL Level | β | 3 (168 hours) |