EP3C40F780C7 vs EP3C40F780I8N Comparison

Detailed side-by-side comparison of EP3C40F780C7 by Intel and EP3C40F780I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780C7 EP3C40F780I8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $139.50 $192.00
Family Cyclone III Cyclone III
Logic Elements (LE) 39,600 β€”
Number of Logic Cells 39,600 β€”
Total Memory Bits 1,161,216 bits β€”
Embedded 18x18 Multipliers 126 β€”
Number of PLLs 4 4
User I/O Count 535 β€”
I/O Banks 8 20
Package 780-ball FBGA (F780) 780-ball FBGA (F780)
Package Dimensions 29 x 29 mm β€”
Ball Pitch 1.0 mm β€”
Core Voltage (VCCINT) 1.2 V β€”
I/O Voltage (VCCIO) 1.2 V to 3.3 V β€”
Operating Temperature 0C to +85C (Commercial) β€”
Speed Grade C7 β€”
Process Technology 60 nm TSMC low-power CMOS TSMC 65 nm low-power CMOS
Configuration Active Serial / Passive Parallel (JTAG) β€”
MSL Level 3 (168 hours) 3
RoHS Status Compliant Compliant
Device Logic Elements β€” 39,600
Logic Array Blocks (LABs/CLBs) β€” 2,475
Embedded Memory (bits) β€” 1,161,216
Embedded Memory (Kbits) β€” 1,134
Embedded Multipliers (18x18) β€” 126
User I/O Pins β€” 535
Nominal Core Supply Voltage β€” 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch β€” 1.0 mm
Operating Temperature Grade β€” Industrial (-40 Β°C to +100 Β°C junction)
Configuration Modes β€” Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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