EP3C40F780I8N vs EP3C40F780I7N Comparison
Detailed side-by-side comparison of EP3C40F780I8N by Intel and EP3C40F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3C40F780I8N
EP3C40F780I8N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I8N β ActiveIntel
EP3C40F780I7N
EP3C40F780I7N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I7N β ActiveSpecification Comparison
| Parameter | EP3C40F780I8N | EP3C40F780I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $192.00 | $92.50 |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | β |
| Logic Array Blocks (LABs/CLBs) | 2,475 | β |
| Embedded Memory (bits) | 1,161,216 | β |
| Embedded Memory (Kbits) | 1,134 | β |
| Embedded Multipliers (18x18) | 126 | β |
| Number of PLLs | 4 | β |
| User I/O Pins | 535 | 535 |
| I/O Banks | 20 | β |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | β |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Package Ball Pitch | 1.0 mm | β |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Operating Temperature Grade | Industrial (-40 Β°C to +100 Β°C junction) | β |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | β |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 | [DATA_NEEDED: MSL rating] |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | Cyclone III |
| Logic Elements | β | 39,600 |
| Embedded Memory | β | 1,161,216 bits (126 M9K blocks) |
| Embedded Multipliers | β | 126 (18x18) |
| PLLs | β | 4 |
| Global Clock Networks | β | 20 |
| Core Voltage | β | 1.2 V |
| Operating Temperature | β | -40C to +100C (industrial) |
| Speed Grade | β | 7 |