EP3C5F256C6 vs EP3C5F256C6N Comparison
Detailed side-by-side comparison of EP3C5F256C6 by Intel and EP3C5F256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256C6 | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.40 | $18.85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | β |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 182 (per DigiKey listing) |
| Total Memory Bits | 423,936 bits | 423936 |
| Embedded Memory | M9K blocks (per Cyclone III family) | β |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | β |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | β |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.2 V |
| Process Technology | 65 nm CMOS, low-k | β |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | β |
| Package | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | β |
| Configuration Modes | AS, PS, JTAG | Serial, Parallel, JTAG, AS, PS |
| RoHS Status | Compliant (lead-free per FBGA package) | β |
| Series | β | EP3C5 |
| Logic Elements (LEs) | β | 5136 |
| Maximum User I/Os | β | 182 |
| Core Process Technology | β | 65 nm CMOS |
| Operating Temperature | β | 0 C to +85 C (commercial "C6" speed grade) |
| RoHS / Lead-Free | β | Lead-free (per distributor listings) |