EP3C5F256C6 vs EP3C5F256C8 Comparison

Detailed side-by-side comparison of EP3C5F256C6 by Intel and EP3C5F256C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5F256C6 EP3C5F256C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $21.40 $12.30
Family Cyclone III β€”
Logic Elements (LE) 5,136 β€”
Logic Array Blocks (LABs) 5136 / 342 (per ADatasheet summary) β€”
Total Memory Bits 423,936 bits 423,936
Embedded Memory M9K blocks (per Cyclone III family) β€”
Embedded 18x18 Multipliers 23 β€”
User I/Os 182 β€”
PLLs 4 Yes (general-purpose PLLs)
Global Clock Networks 20 β€”
Core Voltage 1.15 V to 1.25 V (typical 1.2 V) β€”
Process Technology 65 nm CMOS, low-k 65 nm low-power CMOS
Maximum Operating Frequency [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] β€”
Package 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature (Commercial) 0C to +85C (per device suffix C6) β€”
Configuration Modes AS, PS, JTAG β€”
RoHS Status Compliant (lead-free per FBGA package) Lead Free, MS-034
Device Type β€” FPGA - Field Programmable Gate Array
Series β€” Cyclone III
Logic Elements β€” 5,136
Number of LABs/CLBs β€” 321
Number of Logic Elements/Cells β€” 5,136
Maximum User I/O β€” 182
Number of I/O Banks β€” [DATA_NEEDED: number of I/O banks]
Operating Temperature β€” -40Β°C to +125Β°C
Package Type β€” 256-LBGA (FineLine BGA)
Package Code β€” FBGA-256
Supply Voltage β€” [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values]
Configuration Memory β€” External flash via AS/PS/JTAG/FPP
Embedded Multipliers β€” Yes (18x18 hard multipliers)
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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