EP3C5F256C6N vs EP3C5F256C6 Comparison

Detailed side-by-side comparison of EP3C5F256C6N by Intel and EP3C5F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5F256C6N EP3C5F256C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $18.85 $21.40
Family Cyclone III Cyclone III
Series EP3C5 β€”
Logic Elements (LEs) 5136 β€”
Logic Array Blocks (LABs) 182 (per DigiKey listing) 5136 / 342 (per ADatasheet summary)
Total Memory Bits 423936 423,936 bits
Embedded 18x18 Multipliers 23 23
PLLs 2 4
Maximum User I/Os 182 β€”
Core Process Technology 65 nm CMOS β€”
Core Voltage 1.2 V 1.15 V to 1.25 V (typical 1.2 V)
Operating Temperature 0 C to +85 C (commercial "C6" speed grade) β€”
Package 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch
Mounting Type Surface Mount Surface Mount
RoHS / Lead-Free Lead-free (per distributor listings) β€”
Configuration Modes Serial, Parallel, JTAG, AS, PS AS, PS, JTAG
Logic Elements (LE) β€” 5,136
Embedded Memory β€” M9K blocks (per Cyclone III family)
User I/Os β€” 182
Global Clock Networks β€” 20
Process Technology β€” 65 nm CMOS, low-k
Maximum Operating Frequency β€” [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed]
Operating Temperature (Commercial) β€” 0C to +85C (per device suffix C6)
RoHS Status β€” Compliant (lead-free per FBGA package)

Datasheets & Resources

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