EP3C5F256C6N vs EP3C5F256C8 Comparison

Detailed side-by-side comparison of EP3C5F256C6N by Intel and EP3C5F256C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5F256C6N EP3C5F256C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $18.85 $12.30
Family Cyclone III β€”
Series EP3C5 Cyclone III
Logic Elements (LEs) 5136 β€”
Logic Array Blocks (LABs) 182 (per DigiKey listing) β€”
Total Memory Bits 423936 423,936
Embedded 18x18 Multipliers 23 β€”
PLLs 2 Yes (general-purpose PLLs)
Maximum User I/Os 182 β€”
Core Process Technology 65 nm CMOS β€”
Core Voltage 1.2 V β€”
Operating Temperature 0 C to +85 C (commercial "C6" speed grade) -40Β°C to +125Β°C
Package 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch β€”
Mounting Type Surface Mount Surface Mount
RoHS / Lead-Free Lead-free (per distributor listings) β€”
Configuration Modes Serial, Parallel, JTAG, AS, PS β€”
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements β€” 5,136
Number of LABs/CLBs β€” 321
Number of Logic Elements/Cells β€” 5,136
Maximum User I/O β€” 182
Number of I/O Banks β€” [DATA_NEEDED: number of I/O banks]
Package Type β€” 256-LBGA (FineLine BGA)
Package Code β€” FBGA-256
Supply Voltage β€” [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values]
Configuration Memory β€” External flash via AS/PS/JTAG/FPP
Process Technology β€” 65 nm low-power CMOS
Embedded Multipliers β€” Yes (18x18 hard multipliers)
RoHS Status β€” Lead Free, MS-034
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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