EP3C5F256C8 vs EP3C5F256C6N Comparison

Detailed side-by-side comparison of EP3C5F256C8 by Intel and EP3C5F256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5F256C8 EP3C5F256C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $12.30 $18.85
Device Type FPGA - Field Programmable Gate Array β€”
Series Cyclone III EP3C5
Logic Elements 5,136 β€”
Total Memory Bits 423,936 423936
Number of LABs/CLBs 321 β€”
Number of Logic Elements/Cells 5,136 β€”
Maximum User I/O 182 β€”
Number of I/O Banks [DATA_NEEDED: number of I/O banks] β€”
Operating Temperature -40Β°C to +125Β°C 0 C to +85 C (commercial "C6" speed grade)
Package Type 256-LBGA (FineLine BGA) β€”
Package Code FBGA-256 β€”
Mounting Type Surface Mount Surface Mount
Supply Voltage [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] β€”
Configuration Memory External flash via AS/PS/JTAG/FPP β€”
Process Technology 65 nm low-power CMOS β€”
Embedded Multipliers Yes (18x18 hard multipliers) β€”
PLLs Yes (general-purpose PLLs) 2
RoHS Status Lead Free, MS-034 β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
Family β€” Cyclone III
Logic Elements (LEs) β€” 5136
Logic Array Blocks (LABs) β€” 182 (per DigiKey listing)
Embedded 18x18 Multipliers β€” 23
Maximum User I/Os β€” 182
Core Process Technology β€” 65 nm CMOS
Core Voltage β€” 1.2 V
Package β€” 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch
RoHS / Lead-Free β€” Lead-free (per distributor listings)
Configuration Modes β€” Serial, Parallel, JTAG, AS, PS

Datasheets & Resources

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