EP3CLS100F484C8N vs EP3CLS100F484C7N Comparison
Detailed side-by-side comparison of EP3CLS100F484C8N by Intel and EP3CLS100F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS100F484C8N
EP3CLS100F484C8N - Cyclone III LS 100K LE FPGA, 484-FBGA | Intel
EP3CLS100F484C8N โ ActiveIntel
EP3CLS100F484C7N
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N โ ActiveSpecification Comparison
| Parameter | EP3CLS100F484C8N | EP3CLS100F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $115.40 | $495.80 |
| Series | Cycloneยฎ III LS | โ |
| Family Name | Cyclone III LS | โ |
| Logic Elements | 100,448 | 100,448 |
| Embedded Memory Bits | 4,451,328 bits | โ |
| Number of I/O | 278 (maximum user I/O) | โ |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | โ |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | โ |
| Pin / Ball Count | 484 | โ |
| Supply Voltage (Core) | 1.2 V | โ |
| Speed Grade | C8 (commercial, fastest) | C7 |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| Operating Temperature | 0ยฐC to +85ยฐC (commercial grade) | โ |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Interface | JTAG, Passive Serial, Active Serial | โ |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | โ |
| RoHS Status | Compliant (Pb-free, 'N' suffix) | Compliant (lead-free, N suffix) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA) | โ |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | โ |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | โ |
| Family | โ | Cyclone III LS |
| Embedded Memory (bits) | โ | 4,451,328 |
| User I/O Pins | โ | 278 |
| DSP Blocks (18x18 multipliers) | โ | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | โ | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | โ | 1.2 V |
| Operating Temperature (junction) | โ | 0ยฐC to +85ยฐC (commercial) |
| Package | โ | 484-ball FineLine BGA (FBGA-484) |
| Ball Pitch | โ | 1.0 mm |
| Package Dimensions | โ | [DATA_NEEDED: package body dimensions] |
| Configuration Method | โ | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | โ | Bitstream encryption, JTAG tamper protection |
| Design Software | โ | Quartus II / Intel Quartus Prime |