EP3CLS100F484C8N vs EP3CLS100F484I7 Comparison
Detailed side-by-side comparison of EP3CLS100F484C8N by Intel and EP3CLS100F484I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS100F484C8N
EP3CLS100F484C8N - Cyclone III LS 100K LE FPGA, 484-FBGA | Intel
EP3CLS100F484C8N โ ActiveIntel
EP3CLS100F484I7
EP3CLS100F484I7 - Cyclone III LS FPGA 100K LE | Intel FPGA
EP3CLS100F484I7 โ ActiveSpecification Comparison
| Parameter | EP3CLS100F484C8N | EP3CLS100F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $115.40 | $113.60 |
| Series | Cycloneยฎ III LS | โ |
| Family Name | Cyclone III LS | โ |
| Logic Elements | 100,448 | โ |
| Embedded Memory Bits | 4,451,328 bits | โ |
| Number of I/O | 278 (maximum user I/O) | โ |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | โ |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | โ |
| Pin / Ball Count | 484 | โ |
| Supply Voltage (Core) | 1.2 V | โ |
| Speed Grade | C8 (commercial, fastest) | โ |
| Process Technology | TSMC 65 nm low-power (LP) | TSMC 65 nm low-power (LP) |
| Operating Temperature | 0ยฐC to +85ยฐC (commercial grade) | โ |
| Mounting Type | Surface Mount | โ |
| Configuration Interface | JTAG, Passive Serial, Active Serial | โ |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | โ |
| RoHS Status | Compliant (Pb-free, 'N' suffix) | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA) | โ |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | โ |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | โ |
| Device Family | โ | Cyclone III LS |
| Logic Elements (LE) | โ | 100,448 |
| Logic Array Blocks (LABs) | โ | 278 |
| Total Embedded Memory Bits | โ | 4,451,328 bits |
| Embedded Memory (M9K Blocks) | โ | 610 (per datasheet family) |
| DSP Blocks (18x18 Multipliers) | โ | 66 |
| 18x18 Hardware Multipliers | โ | 16 dedicated |
| Maximum User I/Os | โ | 429 |
| Package | โ | 484-ball FBGA (FineLine BGA) |
| Core Supply Voltage | โ | 1.2 V |
| I/O Standards Supported | โ | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Operating Temperature Range | โ | -40C to +85C (Industrial) |
| Configuration Method | โ | Serial/Parallel, AES-256 encrypted (LS feature) |
| External Memory Support | โ | DDR, DDR2, QDRII, RLDRAM II |