EP3CLS100F780C7N vs EP3C80F780C7N Comparison

Detailed side-by-side comparison of EP3CLS100F780C7N by Intel and EP3C80F780C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS100F780C7N EP3C80F780C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $298.75 $260.00
Family Cyclone III LS β€”
Logic Elements 100,448 β€”
Adaptive Logic Modules (ALMs) 47,526 β€”
Embedded Memory (bits) 4,451,328 β€”
Embedded 18x18 Multipliers 66 β€”
User I/O Pins (max) 413 β€”
PLLs 4 β€”
Global Clock Networks 20 β€”
Core Supply Voltage (VCCINT) 1.2 V β€”
I/O Supply Voltages 1.5 / 1.8 / 2.5 / 3.3 V β€”
Package 780-ball FineLine BGA (FBGA-780) β€”
Speed Grade 7 (commercial) β€”
Temperature Grade Commercial (0C to +85C) β€”
Hard AES Engine Yes (Cyclone III LS security block, AES-256) β€”
Configuration Schemes AS, PS, JTAG, FPP β€”
RoHS Status Compliant β€”
Series β€” Cyclone III
Family Name β€” Cyclone III
Number of Logic Elements β€” 81,264
Number of Logic Cells / CLBs β€” 81,264
Total RAM Bits β€” 2,810,880
Number of I/O β€” 429
Number of Gates β€” [DATA_NEEDED: gates count]
Voltage - Supply β€” 1.15 V to 3.3 V (core and I/O banks)
Operating Temperature β€” 0C to +85C (commercial)
Mounting Type β€” Surface Mount
Package / Case β€” 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch
Supplier Device Package β€” 780-FBGA
Process Technology β€” 65 nm CMOS (TSMC low-k)
Number of PLLs β€” 4
Number of Multipliers (18x18) β€” 288
Maximum Frequency β€” 472.5 MHz
Lead Free / RoHS β€” Lead Free (per LCSC listing)
Configuration Method β€” JTAG, Serial, Parallel (via Quartus Prime / Quartus II)

Datasheets & Resources

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