EP3CLS200F780C8ES vs EP3CLS200F780I7N Comparison

Detailed side-by-side comparison of EP3CLS200F780C8ES by Intel and EP3CLS200F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS200F780C8ES EP3CLS200F780I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $215.00 $240.00
Series Cyclone III LS EP3CLS200
Family Cyclone III LS β€”
Logic Elements (LE) 198,464 β€”
Logic Array Blocks (LABs) 12,404 12,404 LAB
Embedded Memory (bits) 8,211,456 8,211,456
Maximum User I/O 413 413
Embedded 18x18 Multipliers 396 β€”
PLLs 4 4
Process Technology 65 nm CMOS (low-power) 65 nm CMOS (low-power)
Core Supply Voltage 1.2 V β€”
Operating Junction Temperature -40C to +100C (industrial) β€”
Maximum Logic Clock Frequency 402 MHz (typical) β€”
Package 780-ball FBGA (FineLine BGA) 780-ball FBGA (FBGA-780)
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant (lead-free FBGA) Compliant (lead-free per FBGA-780 datasheet note)
Configuration Encryption AES bitstream encryption (LS feature) β€”
Speed Grade 8 7
On-Chip Termination (OCT) Yes (calibrated) β€”
Hot Socketing Supported β€”
Device Family β€” Cyclone III LS
Logic Elements β€” 198,464
Embedded Multipliers β€” 425 (18x18)
Core Voltage (VCCINT) β€” 1.15 V to 1.25 V
Operating Temperature β€” -40 Β°C to +100 Β°C (industrial)
Maximum Internal Frequency β€” [DATA_NEEDED: maximum internal frequency MHz]
Ball Pitch β€” 1.0 mm
Configuration Modes β€” Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

Datasheets & Resources

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