EP3CLS200F780I7N vs EP3CLS200F780C8ES Comparison
Detailed side-by-side comparison of EP3CLS200F780I7N by Intel and EP3CLS200F780C8ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS200F780I7N | EP3CLS200F780C8ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $240.00 | $215.00 |
| Device Family | Cyclone III LS | β |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | β |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,404 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Embedded Multipliers | 425 (18x18) | β |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | β |
| Speed Grade | 7 | 8 |
| Operating Temperature | -40 Β°C to +100 Β°C (industrial) | β |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | β |
| Package | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free per FBGA-780 datasheet note) | Compliant (lead-free FBGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | β |
| Family | β | Cyclone III LS |
| Logic Elements (LE) | β | 198,464 |
| Embedded 18x18 Multipliers | β | 396 |
| Core Supply Voltage | β | 1.2 V |
| Operating Junction Temperature | β | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | β | 402 MHz (typical) |
| Configuration Encryption | β | AES bitstream encryption (LS feature) |
| On-Chip Termination (OCT) | β | Yes (calibrated) |
| Hot Socketing | β | Supported |