EP3SE110F1152C4 vs EP3SE260F1152C2 Comparison
Detailed side-by-side comparison of EP3SE110F1152C4 by Intel and EP3SE260F1152C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 โ Last Time Buy
Specification Comparison
| Parameter | EP3SE110F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,200.00 | $2,400.00 |
| Family | Stratix III E | โ |
| Logic Elements | 107,500 | โ |
| Embedded Memory | 8,936,448 bits | โ |
| Maximum User I/Os | 744 | โ |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | โ |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 10,200 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | โ |
| Maximum Performance | 450 MHz | โ |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | โ |
| Operating Temperature Grade | Commercial (C4) | โ |
| Configuration Memory | SRAM-based (volatile) | โ |
| On-chip Termination | Dynamic, programmable | โ |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | โ |
| RoHS Status | Compliant | Compliant |
| Manufacturer | โ | Intel (formerly Altera) |
| Series | โ | Stratixยฎ III E |
| Logic Elements (LE) | โ | 255,000 |
| Embedded Memory (bits) | โ | 16,672,768 |
| User I/Os | โ | 744 |
| User I/O Banks | โ | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | โ | 1.1 V |
| Package | โ | 1152-ball FC-FBGA (Flip Chip) |
| Mounting Type | โ | Surface Mount |
| Speed Grade | โ | C2 (commercial) |
| Operating Temperature | โ | Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits] |
| Lead-Free | โ | Yes |
| MSL Level | โ | [DATA_NEEDED: MSL rating] |
| Design Software | โ | Quartus II (Stratix III support) |