EP3SE110F780I3 vs EP3CLS200F780I7N Comparison

Detailed side-by-side comparison of EP3SE110F780I3 by Intel and EP3CLS200F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I3 EP3CLS200F780I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $240.00
Family Stratix III E β€”
Logic Elements 107500 198,464
Number of LABs/CLBs 4300 β€”
Number of Logic Elements/Cells 107500 β€”
Total RAM Bits 8936448 β€”
Number of I/O 488 β€”
Voltage - Supply 1.1 V core β€”
Process Technology 65 nm 65 nm CMOS (low-power)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +100C (industrial) -40 Β°C to +100 Β°C (industrial)
Package / Case 780-BBGA, FCBGA (FineLine BGA) β€”
Supplier Device Package 780-FBGA β€”
RoHS Status unknown Compliant (lead-free per FBGA-780 datasheet note)
Moisture Sensitivity Level (MSL) unknown β€”
Grade Industrial β€”
Device Family β€” Cyclone III LS
Series β€” EP3CLS200
Logic Array Blocks (LABs) β€” 12,404 LAB
Embedded Memory (bits) β€” 8,211,456
Embedded Multipliers β€” 425 (18x18)
PLLs β€” 4
Maximum User I/O β€” 413
Core Voltage (VCCINT) β€” 1.15 V to 1.25 V
Speed Grade β€” 7
Maximum Internal Frequency β€” [DATA_NEEDED: maximum internal frequency MHz]
Package β€” 780-ball FBGA (FBGA-780)
Ball Pitch β€” 1.0 mm
Configuration Modes β€” Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

Datasheets & Resources

Browse All Products Create BOM Request Quote