EP3SE110F780I3N vs EP3SE110F780C4N Comparison

Detailed side-by-side comparison of EP3SE110F780I3N by Intel and EP3SE110F780C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I3N EP3SE110F780C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,950.00 $1,395.00
Family Stratix III E Stratix III
Logic Elements 107,500 β€”
Logic Array Blocks (LABs) 4,300 β€”
Embedded Memory Bits 8,936,448 (approximately 1.1 MB) 8936448
Maximum User I/Os 488 β€”
Core Voltage 1.1 V (range 1.05 V to 1.15 V) β€”
Process Technology 65 nm CMOS β€”
Package 780-pin FC-FBGA (Flip-Chip FineLine BGA) β€”
Operating Temperature -40 Β°C to +100 Β°C (Industrial, "I" grade) 0C to 85C (Commercial)
Configuration Interface Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) β€”
Boundary-Scan Test Yes, per IEEE Std. 1149.1 β€”
Speed Grade 3 (Fast) C4
PLLs Yes, with global and regional clock networks β€”
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant Compliant
MSL Level [DATA_NEEDED: MSL level] β€”
Supply Voltage Tolerance 1.05 V to 1.15 V β€”
Series β€” Stratix III E
Logic Elements (LEs) β€” 107500
User I/O Count β€” 488
Number of Terminals β€” 780
Package Type β€” 780-BBGA, FCBGA
Package Code β€” BGA
Terminal Form β€” Ball
Package Shape β€” Square
Process Node β€” 65 nm
Configuration Mode β€” PS / FPP / JTAG

Datasheets & Resources

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