EP3SE110F780I3N vs EP3SE50F780I3G Comparison

Detailed side-by-side comparison of EP3SE110F780I3N by Intel and EP3SE50F780I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I3N EP3SE50F780I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,950.00 $1,082.02
Family Stratix III E Stratix III E
Logic Elements 107,500 β€”
Logic Array Blocks (LABs) 4,300 β€”
Embedded Memory Bits 8,936,448 (approximately 1.1 MB) β€”
Maximum User I/Os 488 β€”
Core Voltage 1.1 V (range 1.05 V to 1.15 V) 1.1 V
Process Technology 65 nm CMOS TSMC 40 nm
Package 780-pin FC-FBGA (Flip-Chip FineLine BGA) 780-pin FC-FBGA (F780) 29x29 mm
Operating Temperature -40 Β°C to +100 Β°C (Industrial, "I" grade) -40C to +100C (Industrial, I3)
Configuration Interface Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) β€”
Boundary-Scan Test Yes, per IEEE Std. 1149.1 β€”
Speed Grade 3 (Fast) 3
PLLs Yes, with global and regional clock networks β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
MSL Level [DATA_NEEDED: MSL level] 3
Supply Voltage Tolerance 1.05 V to 1.15 V β€”
Logic Elements (LE) β€” 47,500
Adaptive Logic Modules (ALM) β€” 19,000
Embedded Memory β€” 8.7 Mbits (M9K + M144K blocks)
DSP Blocks β€” 264 (18x18 multipliers)
Maximum User I/O Pins β€” 488
Transceivers β€” 12 channels, up to 3.75 Gbps
Memory Interfaces β€” DDR3 up to 800 MHz, DDR2, QDR II+ SRAM
PCI Express Hard IP β€” Gen1 x1/x4/x8
Lead-Free β€” Yes

Datasheets & Resources

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