EP3SE110F780I4N vs EP3SE50F780I3G Comparison

Detailed side-by-side comparison of EP3SE110F780I4N by Intel and EP3SE50F780I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I4N EP3SE50F780I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,850.00 $1,082.02
Manufacturer Intel (formerly Altera) β€”
Series Stratix III E β€”
Logic Elements 107,500 β€”
Embedded Memory Bits 8,936,448 bits β€”
Number of LABs/CLBs 4300 β€”
Number of Logic Elements / Cells 107500 β€”
Number of I/O 488 β€”
Package 780-ball FCBGA (FineLine BGA) 780-pin FC-FBGA (F780) 29x29 mm
Package Code (JEDEC) BGA, 780 pins β€”
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature -40C to +100C (industrial) -40C to +100C (Industrial, I3)
Speed Grade 4 3
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal] β€”
Process Node 40 nm β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Lead Free [DATA_NEEDED: lead-free status] β€”
Family β€” Stratix III E
Logic Elements (LE) β€” 47,500
Adaptive Logic Modules (ALM) β€” 19,000
Embedded Memory β€” 8.7 Mbits (M9K + M144K blocks)
DSP Blocks β€” 264 (18x18 multipliers)
Maximum User I/O Pins β€” 488
Transceivers β€” 12 channels, up to 3.75 Gbps
Core Voltage β€” 1.1 V
Process Technology β€” TSMC 40 nm
Memory Interfaces β€” DDR3 up to 800 MHz, DDR2, QDR II+ SRAM
PCI Express Hard IP β€” Gen1 x1/x4/x8
MSL Level β€” 3
Lead-Free β€” Yes

Datasheets & Resources

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