EP3SE260F1152I3 vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152I3 by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152I3 EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $16,500.00 $1,620.00
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 β€”
Number of LABs/CLBs 10,200 10,200
Total RAM Bits 16,672,768 β€”
User I/O Count 744 β€”
Number of Embedded Multipliers (DSP blocks) 768 β€”
Core Voltage 1.1 V 1.1 V
Operating Temperature -40C to +100C (Industrial) 0C to +85C (commercial, 'C' suffix)
Process Technology 65 nm 65 nm CMOS
Maximum Fabric Frequency 500 MHz β€”
Package 1152-BBGA, FC-FBGA (Flip-Chip) 1152-ball FC-FBGA (flip-chip)
Mounting Type Surface Mount Surface Mount (BGA)
Speed Grade I3 (Industrial, speed bin 3) -4 (commercial temperature)
MSL Level [DATA_NEEDED: MSL level] β€”
RoHS Status [DATA_NEEDED: RoHS status] β€”
Product Status Obsolete (per Xecor comparator) Obsolete (per Xecor cross-reference data)
Family β€” Stratix III (Enhanced)
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Maximum Operating Frequency β€” 450 MHz
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP

Datasheets & Resources

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