EP3SE260F1152I3 vs EP3SE260F1152I3G Comparison

Detailed side-by-side comparison of EP3SE260F1152I3 by Intel and EP3SE260F1152I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152I3 EP3SE260F1152I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $16,500.00 $1,240.00
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 β€”
Number of LABs/CLBs 10,200 β€”
Total RAM Bits 16,672,768 β€”
User I/O Count 744 744
Number of Embedded Multipliers (DSP blocks) 768 β€”
Core Voltage 1.1 V β€”
Operating Temperature -40C to +100C (Industrial) β€”
Process Technology 65 nm 40 nm TSMC low-power
Maximum Fabric Frequency 500 MHz β€”
Package 1152-BBGA, FC-FBGA (Flip-Chip) 1152-BBGA, FCBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount (BGA)
Speed Grade I3 (Industrial, speed bin 3) I3 (Industrial, balanced)
MSL Level [DATA_NEEDED: MSL level] β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance not stated in scraped data]
Product Status Obsolete (per Xecor comparator) β€”
Family β€” Stratix III
Logic Elements (LE) β€” 255,000
Embedded Memory Bits β€” 16,672,640 bits
Embedded Memory Bits (alternate) β€” 20,880 Kb (16,672,640 / 1024)
Operating Temperature Range β€” -40C to +100C (Industrial)
Supply Voltage Core β€” 0.9 V (typical, see handbook)
Configuration Bitstream Encryption β€” AES-256 (Stratix III feature)
I/O Standards Supported β€” LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
Moisture Sensitivity Level (MSL) β€” [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow β€” [DATA_NEEDED: peak reflow temperature]
Design Toolchain β€” Quartus II / Quartus Prime
Country of Origin / Distribution β€” Multiple authorized distributors (DigiKey, Mouser)

Datasheets & Resources

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