EP3SE260F1152I4N vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152I4N by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152I4N EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $2,050.00 $1,620.00
Series Stratix III E Stratix III E
Logic Elements 255,000 β€”
Embedded Memory (bits) 16,672,768 β€”
Logic Array Blocks (LABs) 10,200 β€”
Maximum User I/O 744 β€”
DSP Blocks (18x18 multipliers) 896 β€”
Transceivers 48 (up to 8.5 Gbps) β€”
Core Voltage 0.86 V 1.1 V
Process Technology TSMC 40 nm 65 nm CMOS
Package 1152-ball FCBGA (35 mm x 35 mm) 1152-ball FC-FBGA (flip-chip)
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature -40C to +100C (Industrial) 0C to +85C (commercial, 'C' suffix)
Speed Grade 4 -4 (commercial temperature)
MSL Level 3 (168 hours) β€”
RoHS Status Compliant β€”
Family β€” Stratix III (Enhanced)
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
Number of LABs/CLBs β€” 10,200
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Maximum Operating Frequency β€” 450 MHz
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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