EP3SE260F1517C2G vs EP3SE260F1152C2 Comparison

Detailed side-by-side comparison of EP3SE260F1517C2G by Intel and EP3SE260F1152C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1517C2G EP3SE260F1152C2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $2,050.00 $2,400.00
Family Stratix III E โ€”
Logic Elements 254,400 โ€”
Adaptive Logic Modules (ALMs) 81,760 โ€”
Total Memory Bits 16,727,680 (16.67 Mbit) โ€”
Embedded Memory (M9K Blocks) 864 โ€”
Embedded Multipliers (18x18) 768 โ€”
User I/O Pins 976 โ€”
Transceiver Channels 12 โ€”
Transceiver Data Rate (max) 3.75 Gbps (C2 grade) โ€”
PLLs (Fractional + Clock Multiplier) 8 fractional + 4 CMU โ€”
Global Clock Networks 20 โ€”
Package 1517-ball FCBGA, 40x40 mm 1152-ball FC-FBGA (Flip Chip)
Speed Grade C2 (commercial, ~6 ns) C2 (commercial)
Operating Temperature 0C to 85C (commercial, "C" suffix) Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits]
Process Node 40 nm TSMC โ€”
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes โ€”
Manufacturer โ€” Intel (formerly Altera)
Series โ€” Stratixยฎ III E
Logic Elements (LE) โ€” 255,000
Logic Array Blocks (LABs) โ€” 10,200
Embedded Memory (bits) โ€” 16,672,768
User I/Os โ€” 744
User I/O Banks โ€” [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) โ€” 1.1 V
Process Technology โ€” 65 nm CMOS
Mounting Type โ€” Surface Mount
Lead-Free โ€” Yes
MSL Level โ€” [DATA_NEEDED: MSL rating]
Design Software โ€” Quartus II (Stratix III support)

Datasheets & Resources

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