EP3SE260F1517C3 vs EP3SE260F1517C2N Comparison
Detailed side-by-side comparison of EP3SE260F1517C3 by Intel and EP3SE260F1517C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517C3
EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA
EP3SE260F1517C3 β ActiveIntel
EP3SE260F1517C2N
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N β Last Time BuySpecification Comparison
| Parameter | EP3SE260F1517C3 | EP3SE260F1517C2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,800.00 | $4,750.00 |
| Manufacturer | Intel (formerly Altera) | β |
| Series | Stratix III E | β |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| User I/Os | 976 | β |
| DSP Blocks (18x18 multipliers) | 768 | β |
| PLLs | 12 | β |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | β |
| Package | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-BGA |
| Package Pitch | 1.0 mm | β |
| Operating Temperature Grade | Commercial (C suffix) | Commercial (0C to +85C) |
| Speed Grade | 3 | C2 |
| Configuration | SRAM-based, requires external configuration device | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Family | β | Stratix III E |
| Total Memory Bits | β | 16,672,768 |
| Maximum User I/Os | β | 976 |
| Process Technology | β | 65 nm |
| Maximum Core Frequency | β | 600 MHz |
| Configuration Interface | β | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | β | Yes |