EP3SE260F1517C3 vs EP3SE260F1517I3G Comparison
Detailed side-by-side comparison of EP3SE260F1517C3 by Intel and EP3SE260F1517I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517C3
EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA
EP3SE260F1517C3 β ActiveIntel
EP3SE260F1517I3G
EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel
EP3SE260F1517I3G NrndSpecification Comparison
| Parameter | EP3SE260F1517C3 | EP3SE260F1517I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,800.00 | $3,520.00 |
| Manufacturer | Intel (formerly Altera) | β |
| Series | Stratix III E | β |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | β |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| User I/Os | 976 | β |
| DSP Blocks (18x18 multipliers) | 768 | β |
| PLLs | 12 | β |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| Package | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Package Pitch | 1.0 mm | β |
| Operating Temperature Grade | Commercial (C suffix) | Industrial (-40C to +100C) |
| Speed Grade | 3 | β |
| Configuration | SRAM-based, requires external configuration device | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | β |
| Family | β | Stratix III E |
| Embedded Memory Bits | β | 16,672,768 |
| Maximum Operating Frequency | β | 500 MHz |
| User I/O Count | β | 976 |
| Embedded Multipliers | β | 768 (18x18) |
| PLL Count | β | 12 |
| Transceiver Data Rate | β | Up to 6.375 Gbps |
| Lead-Free / RoHS | β | Yes (RoHS compliant per DigiKey listing) |
| MSL Level | β | [DATA_NEEDED: MSL level] |