EP3SE260F1517I3 vs EP3SE260F1517I4L Comparison

Detailed side-by-side comparison of EP3SE260F1517I3 by Intel and EP3SE260F1517I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1517I3 EP3SE260F1517I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $10,500.00 $2,800.00
Family Stratix III E Stratix III Enhanced (E)
Logic Elements 255,000 255,000
Embedded Memory (bits) 16,672,768 β€”
Logic Array Blocks (LABs) 10,200 β€”
Maximum User I/Os 976 β€”
Package 1517-BBGA, FCBGA β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature Grade Industrial β€”
Junction Temperature Range -40C to +125C β€”
Core Voltage 1.0 V typical β€”
Process Technology 65 nm CMOS 65 nm CMOS
Maximum Core Frequency 717 MHz β€”
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL β€”
RoHS Status Compliant Compliant
Configuration SRAM-based, volatile (requires external configuration device) β€”
Series β€” Stratix III
Embedded Memory β€” 16,672,768 bits (16.6 Mbits)
Maximum User I/O β€” 976
Package Type β€” 1517-BBGA, FCBGA
Package Dimensions β€” 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch)
Operating Temperature β€” -40C to +100C (Industrial)
Temperature Grade β€” Industrial
Speed Grade β€” I4
Lead-Free / RoHS β€” Yes (L suffix)
Supply Voltage (Core) β€” [DATA_NEEDED: core voltage]
DSP Blocks (18x18 Multipliers) β€” 768
Configuration Method β€” JTAG, Passive Serial, Fast Passive Parallel
MSL Level β€” 3 (per JEDEC J-STD-020)

Datasheets & Resources

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