EP3SE260F1517I3G vs EP3SE260F1517I3 Comparison
Detailed side-by-side comparison of EP3SE260F1517I3G by Intel and EP3SE260F1517I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517I3G | EP3SE260F1517I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,520.00 | $10,500.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | β |
| Maximum Operating Frequency | 500 MHz | β |
| Core Voltage | 1.1 V | 1.0 V typical |
| User I/O Count | 976 | β |
| Package | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-BBGA, FCBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Process Node | 65 nm | β |
| Embedded Multipliers | 768 (18x18) | β |
| PLL Count | 12 | β |
| Transceiver Data Rate | Up to 6.375 Gbps | β |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | β |
| MSL Level | [DATA_NEEDED: MSL level] | β |
| Embedded Memory (bits) | β | 16,672,768 |
| Logic Array Blocks (LABs) | β | 10,200 |
| Maximum User I/Os | β | 976 |
| Junction Temperature Range | β | -40C to +125C |
| Process Technology | β | 65 nm CMOS |
| Maximum Core Frequency | β | 717 MHz |
| I/O Standards Supported | β | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS Status | β | Compliant |
| Configuration | β | SRAM-based, volatile (requires external configuration device) |