EP3SE260F1517I4L vs EP3SE260F1517I3 Comparison
Detailed side-by-side comparison of EP3SE260F1517I4L by Intel and EP3SE260F1517I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517I4L | EP3SE260F1517I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,800.00 | $10,500.00 |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Series | Stratix III | β |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | β |
| Maximum User I/O | 976 | β |
| Package Type | 1517-BBGA, FCBGA | β |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Temperature Grade | Industrial | β |
| Speed Grade | I4 | β |
| Lead-Free / RoHS | Yes (L suffix) | β |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | β |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| DSP Blocks (18x18 Multipliers) | 768 | β |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | β |
| MSL Level | 3 (per JEDEC J-STD-020) | β |
| RoHS Status | Compliant | Compliant |
| Embedded Memory (bits) | β | 16,672,768 |
| Logic Array Blocks (LABs) | β | 10,200 |
| Maximum User I/Os | β | 976 |
| Package | β | 1517-BBGA, FCBGA |
| Operating Temperature Grade | β | Industrial |
| Junction Temperature Range | β | -40C to +125C |
| Core Voltage | β | 1.0 V typical |
| Maximum Core Frequency | β | 717 MHz |
| I/O Standards Supported | β | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | β | SRAM-based, volatile (requires external configuration device) |