EP3SE260H780C3 vs EP3SE260H780I4N Comparison
Detailed side-by-side comparison of EP3SE260H780C3 by Intel and EP3SE260H780I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N β Last Time BuySpecification Comparison
| Parameter | EP3SE260H780C3 | EP3SE260H780I4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,180.00 | $2,150.00 |
| Device Family | Stratix III Enhanced (Stratix III E) | β |
| Series | EP3SE | β |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | β |
| Operating Voltage (Auxiliary) | 1.1 V | β |
| Process Technology | 65 nm CMOS | 65 nm |
| Speed Grade | C3 | β |
| Operating Temperature | Commercial, 0C to +85C | -40C to +100C (Industrial) |
| Maximum Core Frequency | 500 MHz | β |
| Package | 780-ball FCBGA (HBGA), flip-chip | 780-pin FC-HFBGA (FCBGA) |
| Mounting Type | Surface Mount (BGA) | β |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) | β |
| Packaging Type | Tray | β |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | β |
| RoHS Status | Compliant (per product listings) | Compliant |
| Family | β | Stratix III Enhanced (Stratix III E) |
| Embedded Memory Bits | β | 16,672,768 bits |
| Core Voltage | β | 1.1 V |
| Maximum Operating Frequency | β | 450 MHz |
| Package Dimensions | β | 33 mm x 33 mm |
| Ball Pitch | β | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | β | AS, PS, JTAG, FPP |
| Boundary Scan | β | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | β | Yes |
| Moisture Sensitivity Level | β | [DATA_NEEDED: MSL rating] |