EP3SE260H780C4L vs EP3SE260H780I4L Comparison

Detailed side-by-side comparison of EP3SE260H780C4L by Intel and EP3SE260H780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260H780C4L EP3SE260H780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,190.00 $1,395.00
Family Stratix III E Stratix III E (Enhanced)
Logic Elements 255,000 255,000
LABs/CLBs 10,200 β€”
Total RAM Bits 16,672,768 (16.7 Mbit) β€”
User I/O Count 488 488
Package 780-ball FCBGA (HBGA 33x33 mm) β€”
Speed Grade C4 (middle/slow tier) β€”
Core Voltage 0.9 V (nominal) 0.9 V
Operating Junction Temperature 0C to +85C (commercial) β€”
Mounting Type Surface Mount (flip-chip BGA) Surface Mount (flip-chip)
MSL Level [DATA_NEEDED: MSL level] β€”
RoHS Status Compliant (lead-free per datasheet) Compliant (lead-free)
Transceivers Up to 24 multi-gigabit transceivers β€”
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers β€”
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Total Memory Bits β€” 16,672,640
Number of LABs/CLBs β€” [DATA_NEEDED: LAB count]
Process Technology β€” 65 nm
Package Type β€” 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers β€” 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate β€” 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers β€” [DATA_NEEDED: per-package multiplier count]
Operating Temperature β€” Industrial, -40C to +85C
Pin/Package β€” 780-BBGA, FCBGA (flip-chip)

Datasheets & Resources

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