EP3SE260H780I4 vs EP3SE260H780C4L Comparison
Detailed side-by-side comparison of EP3SE260H780I4 by Intel and EP3SE260H780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260H780I4 | EP3SE260H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,390.00 | $1,190.00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | β |
| Logic Array Blocks (LABs) | 10,200 | β |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | β |
| Maximum User I/Os | 488 | β |
| Process Technology | 65 nm CMOS | β |
| Core Voltage | 1.1 V | 0.9 V (nominal) |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | β |
| DSP Blocks | approximately 768 (18x18 multipliers) | β |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | β |
| Package | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Operating Temperature | -40C to +100C (industrial, 'I' grade) | β |
| Speed Grade | 4 | C4 (middle/slow tier) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free per datasheet) |
| LABs/CLBs | β | 10,200 |
| Total RAM Bits | β | 16,672,768 (16.7 Mbit) |
| User I/O Count | β | 488 |
| Operating Junction Temperature | β | 0C to +85C (commercial) |
| MSL Level | β | [DATA_NEEDED: MSL level] |
| Transceivers | β | Up to 24 multi-gigabit transceivers |
| Memory Interface | β | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | β | PS, FPP, JTAG with EPCS/EPCQ |