EP3SE260H780I4 vs EP3SE260H780I4N Comparison
Detailed side-by-side comparison of EP3SE260H780I4 by Intel and EP3SE260H780I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N β Last Time BuySpecification Comparison
| Parameter | EP3SE260H780I4 | EP3SE260H780I4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,390.00 | $2,150.00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | β |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | β |
| Maximum User I/Os | 488 | β |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | β |
| DSP Blocks | approximately 768 (18x18 multipliers) | β |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | 450 MHz |
| Package | 780-ball FC-HFBGA (HBGA) | 780-pin FC-HFBGA (FCBGA) |
| Operating Temperature | -40C to +100C (industrial, 'I' grade) | -40C to +100C (Industrial) |
| Speed Grade | 4 | β |
| Mounting Type | Surface Mount (BGA) | β |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Embedded Memory Bits | β | 16,672,768 bits |
| User I/Os | β | 488 |
| Package Dimensions | β | 33 mm x 33 mm |
| Ball Pitch | β | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | β | AS, PS, JTAG, FPP |
| Boundary Scan | β | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | β | Yes |
| Moisture Sensitivity Level | β | [DATA_NEEDED: MSL rating] |