EP3SE260H780I4 vs EP3SL200H780I4 Comparison
Detailed side-by-side comparison of EP3SE260H780I4 by Intel and EP3SL200H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260H780I4 | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,390.00 | $6,255.75 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III |
| Logic Elements | 255,000 | β |
| Logic Cells | 255,000 | β |
| Logic Array Blocks (LABs) | 10,200 | 8000 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | β |
| Maximum User I/Os | 488 | β |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | β |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | β |
| DSP Blocks | approximately 768 (18x18 multipliers) | β |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | β |
| Package | 780-ball FC-HFBGA (HBGA) | β |
| Operating Temperature | -40C to +100C (industrial, 'I' grade) | β |
| Speed Grade | 4 | I4 (industrial) |
| Mounting Type | Surface Mount (BGA) | β |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Series | β | Stratix III L |
| Logic Elements (LE) | β | 200,000 |
| Embedded Memory Bits | β | 10,901,504 |
| User I/O Count | β | 488 |
| DSP Multipliers (18x18) | β | 384 |
| Voltage - Core Supply | β | 1.1 V |
| Package Type | β | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | β | 33 mm x 33 mm |
| Operating Junction Temperature | β | -40C to +100C (industrial) |
| Configuration Memory | β | SRAM-based, volatile |
| Design Tool | β | Quartus II (legacy) / Quartus Prime |