EP3SE260H780I4L vs EP3SL50F780I4L Comparison

Detailed side-by-side comparison of EP3SE260H780I4L by Intel and EP3SL50F780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260H780I4L EP3SL50F780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $695.09
Family Stratix III E (Enhanced) Stratix III L
Logic Elements 255,000 47,500
Total Memory Bits 16,672,640 β€”
Number of LABs/CLBs [DATA_NEEDED: LAB count] β€”
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) β€”
Mounting Type Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) β€”
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) β€”
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] β€”
Operating Temperature Industrial, -40C to +85C -40C to +100C (Industrial)
RoHS Status Compliant (lead-free) β€”
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel β€”
Pin/Package 780-BBGA, FCBGA (flip-chip) β€”
Embedded Memory (bits) β€” 2,184,192
I/O Banks β€” 8
Package β€” 780-BBGA, FCBGA (29 mm)
Lead-Free / RoHS β€” Yes (L suffix)
Speed Grade β€” I4
MSL Level β€” [DATA_NEEDED: MSL moisture sensitivity level]
Configuration Memory β€” SRAM-based, volatile
Design Suite β€” Quartus II / Quartus Prime (Stratix III support)
Device Sub-Family β€” Low-Power (L)
Country of Origin β€” [DATA_NEEDED: COO not specified in source data]

Datasheets & Resources

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