EP3SE50F484C4LN vs EP3SE50F484I3N Comparison
Detailed side-by-side comparison of EP3SE50F484C4LN by Intel and EP3SE50F484I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE50F484C4LN | EP3SE50F484I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $772.12 | $841.66 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | β |
| LABs/CLBs | 1900 | β |
| Total RAM Bits | 2,344,448 (2286 Kbit) | β |
| Number of I/O | 296 | β |
| Number of Multipliers (18x18) | 384 | β |
| Voltage - Supply (Core) | 0.85 V to 1.1 V | β |
| Voltage - Supply (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Package / Case | 484-BBGA, FCBGA (FineLine BGA) | β |
| Lead Free / RoHS | Lead free / RoHS compliant | β |
| Process Node | 40 nm CMOS | β |
| Speed Grade | C4 | I3 (industrial, bin 3) |
| Configuration | FPP / AS / JTAG | β |
| Logic Elements | β | 47,500 |
| Number of LABs | β | 1,900 |
| Total Memory Bits | β | 5,760,000 |
| Maximum User I/O | β | 296 |
| Number of I/O Banks | β | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | β | 0.9 V |
| Auxiliary Voltage VCCAUX | β | 1.1 V |
| Process Technology | β | 65 nm |
| Maximum Internal Frequency | β | 500 MHz |
| Package | β | 484-pin FC-FBGA (flip-chip BGA) |
| Lead-Free / RoHS | β | Yes (N suffix) |
| Configuration Method | β | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | β | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | β | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | β | [DATA_NEEDED: number of embedded transceivers] |