EP3SE50F484I3 vs EP3SL50F484I3 Comparison

Detailed side-by-side comparison of EP3SE50F484I3 by Intel and EP3SL50F484I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F484I3 EP3SL50F484I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $188.00 $701.23
Family Stratix III E Stratix III L (Low Power)
Logic Elements 47,500 β€”
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits β€”
User I/Os 296 β€”
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Package 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature Grade Industrial (-40 Β°C to +100 Β°C) β€”
Speed Grade I3 (-3 speed bin, industrial) β€”
DSP Blocks Yes (embedded multipliers and accumulators) β€”
Configuration Modes AS, PS, FPP, JTAG β€”
PLLs Yes (multiple, for clock management) β€”
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X β€”
Transceivers Multi-gigabit transceivers supported Stratix III L β€” supports high-speed serial transceivers per family datasheet
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant β€”
Lead-Free Yes β€”
Device Logic Elements β€” 47,500
Embedded Memory (bits) β€” 2,184,192
Maximum User I/O β€” 296
Internal Operating Frequency β€” 500 MHz
Operating Temperature β€” 0 Β°C to +85 Β°C (commercial)
Lead-Free / RoHS β€” [DATA_NEEDED: lead-free/RoHS status]
MSL Level β€” [DATA_NEEDED: MSL level]
Configuration Scheme β€” SRAM-based (volatile, requires external config device)

Datasheets & Resources

Browse All Products Create BOM Request Quote