EP3SE50F484I4L vs EP3SE50F484I4LG Comparison

Detailed side-by-side comparison of EP3SE50F484I4L by Intel and EP3SE50F484I4LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ Last Time Buy
Intel
EP3SE50F484I4LG EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

EP3SE50F484I4LG ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE50F484I4L EP3SE50F484I4LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,290.00 $1,340.00
Family Stratix III E Stratix III (Enhanced)
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 β€”
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] 19,000
Embedded Memory 5,760 Kbit (5.625 Mbit) β€”
Embedded Multipliers (18x18) 384 β€”
Maximum User I/O 296 β€”
Maximum Core Clock 717 MHz (per third-party listing) β€”
Speed Grade 4 (slowest) β€”
Operating Temperature Range Industrial (I): -40C to +100C junction -40C to +100C (Industrial, TJ)
Process Node 40 nm CMOS β€”
Package 484-ball FCBGA (FBGA-484) 484-ball FBGA / FCBGA
Mounting Type Surface Mount (BGA) Surface Mount (SMD/SMT)
Supply Voltage Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) β€”
Configuration Method Quartus II / EPCS serial / parallel β€”
Lead-Free (Pb-free) Yes (L suffix) β€”
RoHS Status Compliant Compliant
MSL Level MSL3 (per JEDEC J-STD-020, typical for FBGA-484) β€”
Series β€” Stratix III E
LABs/CLBs β€” 1,900
Total Embedded Memory β€” 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source)
Number of DSP Blocks β€” 104 (18x18 multipliers)
Number of PLLs β€” 8
User I/O Count β€” 296
Core Supply Voltage (Vccint) β€” 0.86 V to 1.15 V (1.1 V nominal)
Packaging β€” Tray
Process Technology β€” 40 nm CMOS
Configuration Interface β€” Passive Serial / Fast Passive Parallel / JTAG
Bitstream Encryption β€” 256-bit AES

Datasheets & Resources

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