EP3SE50F780C3 vs EP3SL50F780C3 Comparison

Detailed side-by-side comparison of EP3SE50F780C3 by Intel and EP3SL50F780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C3 EP3SL50F780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $890.00 $540.00
Family Stratix III E Stratix III L (low-power)
Logic Elements (LE) 47,500 β€”
Embedded Memory (BRAM) 5,760 Kbits β€”
User I/Os 488 488
Package 780-ball FC-FBGA (FineLine BGA) β€”
Process Technology 65 nm β€”
Core Voltage 1.1 V β€”
Logic Voltage 0.9 V β€”
Transceiver Speed (max) 500 MHz β€”
Total LABs/CLBs 1900 β€”
DSP Blocks [DATA_NEEDED: DSP block count] β€”
Number of Transceivers [DATA_NEEDED: transceiver count] β€”
Mounting Type Surface Mount (BGA) β€”
Operating Temperature 0C to +85C (Commercial grade, 'C' suffix) 0C to +85C (Commercial)
RoHS Status [DATA_NEEDED: RoHS status] Compliant
MSL Level [DATA_NEEDED: MSL level] β€”
Series β€” Stratix III
Logic Elements β€” 47,500
Logic Array Blocks (LABs) β€” 1,900
Embedded Memory Bits β€” 2,184,192
Package Type β€” 780-BBGA, FCBGA (FineLine)
Device Pin Count β€” 780
Speed Grade β€” 3
Supply Voltage (Core) β€” [DATA_NEEDED: VCCINT nominal value]
PLLs β€” 12
Global Clock Networks β€” 24
Process Node β€” 65 nm TSMC
Configuration Method β€” SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free β€” Lead-Free (per package marking); Halogen-Free status unknown
Moisture Sensitivity Level (MSL) β€” MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Datasheets & Resources

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