EP3SE50F780C4L vs EP3SE260H780C4L Comparison

Detailed side-by-side comparison of EP3SE50F780C4L by Intel and EP3SE260H780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C4L EP3SE260H780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,320.00 $1,190.00
Series Stratix III E β€”
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 β€”
Embedded Memory 5,760,000 bits β€”
User I/Os 488 β€”
DSP Blocks (18x18 multipliers) 304 (19x16) β€”
Package 780-ball FCBGA (Flip-Chip BGA) 780-ball FCBGA (HBGA 33x33 mm)
Process Node 40 nm β€”
Core Voltage 1.1 V 0.9 V (nominal)
Speed Grade C4 (commercial, speed 4) C4 (middle/slow tier)
Lead-Free (L suffix) Yes β€”
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced β€”
Operating Temperature [DATA_NEEDED: full industrial/commercial grade] β€”
RoHS Status Compliant (lead-free) Compliant (lead-free per datasheet)
Transceivers [DATA_NEEDED: per Stratix III E variant] Up to 24 multi-gigabit transceivers
PLLs [DATA_NEEDED: PLL count] β€”
Logic Elements β€” 255,000
LABs/CLBs β€” 10,200
Total RAM Bits β€” 16,672,768 (16.7 Mbit)
User I/O Count β€” 488
Operating Junction Temperature β€” 0C to +85C (commercial)
Mounting Type β€” Surface Mount (flip-chip BGA)
MSL Level β€” [DATA_NEEDED: MSL level]
Memory Interface β€” DDR3, DDR2, QDRII+, RLDRAM II controllers
Configuration Mode β€” PS, FPP, JTAG with EPCS/EPCQ

Datasheets & Resources

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