EP3SE50F780C4L vs EP3SE50F780C4G Comparison

Detailed side-by-side comparison of EP3SE50F780C4L by Intel and EP3SE50F780C4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C4L EP3SE50F780C4G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,320.00 $593.00
Series Stratix III E Stratix III
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 β€”
Embedded Memory 5,760,000 bits 5.76 Mbit (5760000 bit)
User I/Os 488 β€”
DSP Blocks (18x18 multipliers) 304 (19x16) β€”
Package 780-ball FCBGA (Flip-Chip BGA) 780-ball FBGA (FCBGA)
Process Node 40 nm β€”
Core Voltage 1.1 V β€”
Speed Grade C4 (commercial, speed 4) β€”
Lead-Free (L suffix) Yes β€”
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced β€”
Operating Temperature [DATA_NEEDED: full industrial/commercial grade] β€”
RoHS Status Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] β€”
PLLs [DATA_NEEDED: PLL count] β€”
Logic Elements β€” 47,500 LE
Adaptive Logic Modules (ALMs) β€” 19,000 ALM
Number of I/Os β€” 488
Number of Logic Array Blocks (LABs) β€” [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) β€” [DATA_NEEDED: 18x18 multiplier count]
Process Technology β€” 40 nm TSMC
Core Supply Voltage β€” 1.1 V
Operating Temperature Range β€” 0 C to +85 C (commercial)
Mounting Type β€” Surface Mount (SMD/SMT)
Lead-Free β€” Yes
MSL Level β€” MSL3 (per JEDEC J-STD-020)
Configuration Memory β€” SRAM-based (volatile, requires configuration device)
Design Software β€” Quartus II

Datasheets & Resources

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