EP3SE50F780C4N vs EP3SE50F780C2N Comparison

Detailed side-by-side comparison of EP3SE50F780C4N by Intel and EP3SE50F780C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C4N EP3SE50F780C2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,430.00 $278.90
Family Stratix III E Stratix III Enhanced (E)
Logic Elements (LE) 47,500 β€”
Embedded Memory Bits 5,760,000 β€”
Embedded Memory (M9K/M144K blocks) 488 (per family datasheet) β€”
Number of LABs 1900 β€”
Maximum User I/Os 488 β€”
DSP Blocks (18x18 multipliers) 432 β€”
PLLs 12 (per family datasheet) β€”
Maximum Operating Frequency 717 MHz β€”
Transceiver Channels Up to 12 (per family, model-dependent) 12 (data rate not in source data)
Transceiver Data Rate Up to 6.375 Gbps (per Stratix III E family) β€”
Process Node 40 nm β€”
Package 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch 780-ball FC-FBGA (FBGA-780)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) β€”
Operating Temperature 0C to +85C (C4 commercial grade) β€”
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel β€”
RoHS Status Lead-free / RoHS compliant β€”
MSL Level 3 (per JEDEC J-STD-020, FBGA package) β€”
Hard Memory Controller DDR2/DDR3 SDRAM (per Stratix III E family) β€”
Logic Elements β€” 47,500
Adaptive Logic Modules (ALMs) β€” 19,000
Embedded Memory β€” 5,760,000 bits
DSP Blocks β€” Yes (number not in source data)
User I/O Count β€” 488
Process Technology β€” 65 nm CMOS
Core Voltage β€” 0.9 V to 1.1 V
Maximum Internal Clock Frequency β€” 600 MHz
Speed Grade β€” C2
Temperature Grade β€” Commercial (C2)
Lead Free β€” Yes
Configuration Mode β€” Passive Serial / Fast Passive Parallel

Datasheets & Resources

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