EP3SE50F780I3G vs EP3SE110F780I3N Comparison

Detailed side-by-side comparison of EP3SE50F780I3G by Intel and EP3SE110F780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780I3G EP3SE110F780I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,082.02 $1,950.00
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 β€”
Adaptive Logic Modules (ALM) 19,000 β€”
Embedded Memory 8.7 Mbits (M9K + M144K blocks) β€”
DSP Blocks 264 (18x18 multipliers) β€”
Maximum User I/O Pins 488 β€”
Transceivers 12 channels, up to 3.75 Gbps β€”
Core Voltage 1.1 V 1.1 V (range 1.05 V to 1.15 V)
Process Technology TSMC 40 nm 65 nm CMOS
Package 780-pin FC-FBGA (F780) 29x29 mm 780-pin FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature -40C to +100C (Industrial, I3) -40 Β°C to +100 Β°C (Industrial, "I" grade)
Speed Grade 3 3 (Fast)
Memory Interfaces DDR3 up to 800 MHz, DDR2, QDR II+ SRAM β€”
PCI Express Hard IP Gen1 x1/x4/x8 β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level 3 [DATA_NEEDED: MSL level]
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Logic Elements β€” 107,500
Logic Array Blocks (LABs) β€” 4,300
Embedded Memory Bits β€” 8,936,448 (approximately 1.1 MB)
Maximum User I/Os β€” 488
Configuration Interface β€” Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1)
Boundary-Scan Test β€” Yes, per IEEE Std. 1149.1
PLLs β€” Yes, with global and regional clock networks
Supply Voltage Tolerance β€” 1.05 V to 1.15 V

Datasheets & Resources

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