EP3SL200F1517I3N vs EP3SL200F1517I4LN Comparison

Detailed side-by-side comparison of EP3SL200F1517I3N by Intel and EP3SL200F1517I4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200F1517I3N EP3SL200F1517I4LN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,620.00 $6,300.00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Number of LABs 8000 β€”
Total Memory Bits 10,901,504 β€”
User I/Os 976 β€”
Number of Logic Cells 200000 β€”
Process Technology 65 nm 65 nm TSMC low-power
Core Voltage 1.1 V β€”
Maximum Internal Frequency 500 MHz β€”
Number of Transceivers [DATA_NEEDED: number of transceivers] β€”
Package 1517-BBGA, FCBGA (FC-FBGA) 1517-BBGA, FCBGA
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial)
Supplier Device Package 1517-FBGA β€”
RoHS Status Compliant Compliant
Configuration Memory SRAM-based β€”
Number of 18x18 Multipliers 384 β€”
Embedded Memory Bits β€” 10,901,504
Logic Array Blocks (LABs) β€” 8,000
User I/O Pins β€” 976
Lead-Free β€” Yes
MSL Level β€” [DATA_NEEDED: MSL moisture sensitivity level]
Supply Voltage Core β€” [DATA_NEEDED: VCC core voltage]
Transceiver Data Rate (max) β€” [DATA_NEEDED: max transceiver rate]
DSP Blocks (18x18 multipliers) β€” 384
DSP Performance β€” 288 GMACS
Configuration Method β€” Passive Parallel / Active Serial / JTAG
Ball Pitch β€” 1.0 mm
Package Dimensions β€” 40 mm x 40 mm

Datasheets & Resources

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