EP3SL200F1517I4LN vs EP3SL200F1517I3N Comparison

Detailed side-by-side comparison of EP3SL200F1517I4LN by Intel and EP3SL200F1517I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200F1517I4LN EP3SL200F1517I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $6,300.00 $1,620.00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 β€”
Logic Array Blocks (LABs) 8,000 β€”
User I/O Pins 976 β€”
Package 1517-BBGA, FCBGA 1517-BBGA, FCBGA (FC-FBGA)
Process Technology 65 nm TSMC low-power 65 nm
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant Compliant
Lead-Free Yes β€”
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] β€”
Supply Voltage Core [DATA_NEEDED: VCC core voltage] β€”
Transceiver Data Rate (max) [DATA_NEEDED: max transceiver rate] β€”
DSP Blocks (18x18 multipliers) 384 β€”
DSP Performance 288 GMACS β€”
Configuration Method Passive Parallel / Active Serial / JTAG β€”
Ball Pitch 1.0 mm β€”
Package Dimensions 40 mm x 40 mm β€”
Number of LABs β€” 8000
Total Memory Bits β€” 10,901,504
User I/Os β€” 976
Number of Logic Cells β€” 200000
Core Voltage β€” 1.1 V
Maximum Internal Frequency β€” 500 MHz
Number of Transceivers β€” [DATA_NEEDED: number of transceivers]
Supplier Device Package β€” 1517-FBGA
Configuration Memory β€” SRAM-based
Number of 18x18 Multipliers β€” 384

Datasheets & Resources

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