EP3SL200H780C2 vs EP3SL200H780I4 Comparison

Detailed side-by-side comparison of EP3SL200H780C2 by Intel and EP3SL200H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C2 EP3SL200H780I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $6,950.00 $6,255.75
Series Stratix III L Stratix III L
Logic Elements 200,000 β€”
LABs / CLBs 8000 β€”
Total Memory Bits 10,901,504 β€”
User I/O Count 488 488
Package 780-BBGA, FCBGA β€”
Operating Temperature 0C to +85C (Commercial) β€”
Mounting Type Surface Mount β€”
MSL Level [DATA_NEEDED: MSL level] β€”
Process Node 65 nm β€”
Voltage - Core [DATA_NEEDED: core voltage] β€”
Voltage - I/O [DATA_NEEDED: I/O voltage] β€”
DSP Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] 384
Transceivers [DATA_NEEDED: transceiver count for H780] β€”
RoHS Status Compliant Compliant
Lead Free Yes β€”
Family β€” Stratix III
Logic Elements (LE) β€” 200,000
Logic Array Blocks (LABs) β€” 8000
Embedded Memory Bits β€” 10,901,504
Voltage - Core Supply β€” 1.1 V
Process Technology β€” 65 nm CMOS
Package Type β€” 780-BBGA / FCBGA (FC-HFBGA)
Package Dimensions β€” 33 mm x 33 mm
Speed Grade β€” I4 (industrial)
Operating Junction Temperature β€” -40C to +100C (industrial)
Configuration Memory β€” SRAM-based, volatile
Design Tool β€” Quartus II (legacy) / Quartus Prime

Datasheets & Resources

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