EP3SL200H780C4L vs EP3SL200H780I4LN Comparison
Detailed side-by-side comparison of EP3SL200H780C4L by Intel and EP3SL200H780I4LN by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780C4L | EP3SL200H780I4LN |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6,459.35 | $1,280.00 |
| Manufacturer | Intel (formerly Altera) | Intel / Altera (now Intel PSG) |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements | 200,000 | β |
| Embedded Memory | 6.5 Mbit | β |
| User I/O Count | 488 | β |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | β |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | β |
| Package Mounting | Surface Mount | β |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | β |
| Speed Grade | -4 (medium performance, commercial) | I4 (Industrial, mid-speed grade) |
| Operating Temperature | 0C to 85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | β |
| RoHS Status | Compliant | RoHS Compliant (lead-free) |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | β |
| Family | β | Stratix III L (Low-Power) |
| Number of Logic Elements / Cells | β | 200,000 |
| Number of LABs / CLBs | β | 8,000 |
| Total RAM Bits | β | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | β | 488 |
| Voltage - Supply | β | 0.9 V core (selectable Vcore) |
| Mounting Type | β | Surface Mount |
| Package / Case | β | 780-BBGA, FCBGA (Flip-Chip BGA) |
| MSL Level | β | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | β | LN = lead-free, industrial temp, H780 780-ball package |