EP3SL200H780I3N vs EP3SL200H780I4L Comparison

Detailed side-by-side comparison of EP3SL200H780I3N by Intel and EP3SL200H780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780I3N EP3SL200H780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $7,200.00 $1,395.00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
RAM Bits 10,901,504 β€”
User I/O 488 β€”
Package 780-BBGA, FCBGA 780-pin FC-HFBGA (Flip-Chip)
Package Pin Count 780 β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial)
Supply Voltage (Core) 0.9 V β€”
Technology CMOS, 40 nm β€”
Process Node 40 nm β€”
Number of Terminals 780 β€”
Case / Package Code BGA-780 β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Logic Array Blocks (LABs) β€” 8,000
Embedded Memory (Bits) β€” 10,901,504
Maximum User I/O β€” 488
Core Supply Voltage β€” 0.86 V to 1.15 V
Process Technology β€” 65 nm CMOS
Internal Performance β€” 375 MHz
Transceivers β€” Up to 24 channels
Transceiver Data Rate β€” Up to 6.375 Gbps
DSP Blocks β€” 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support β€” DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support β€” IEEE Std 1149.1 Boundary-Scan
Speed Grade β€” I4 (Industrial)
HardCopy Support β€” Compatible (Lattice-style migration path via HardCopy III)

Datasheets & Resources

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