EP3SL200H780I4 vs EP3SE260H780I4 Comparison

Detailed side-by-side comparison of EP3SL200H780I4 by Intel and EP3SE260H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SL200H780I4

EP3SL200H780I4 - Stratix III L FPGA, 200K LE, 780-FCBGA | Intel

EP3SL200H780I4 Nrnd
Intel
EP3SE260H780I4

EP3SE260H780I4 - 255K LE Stratix III FPGA, 780-BGA | Intel

EP3SE260H780I4 Nrnd

Specification Comparison

Parameter EP3SL200H780I4 EP3SE260H780I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $6,255.75 $1,390.00
Series Stratix III L β€”
Family Stratix III Stratix III Enhanced (Stratix III E)
Logic Elements (LE) 200,000 β€”
Logic Array Blocks (LABs) 8000 10,200
Embedded Memory Bits 10,901,504 β€”
User I/O Count 488 β€”
DSP Multipliers (18x18) 384 β€”
Voltage - Core Supply 1.1 V β€”
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) β€”
Package Dimensions 33 mm x 33 mm β€”
Speed Grade I4 (industrial) 4
Operating Junction Temperature -40C to +100C (industrial) β€”
Configuration Memory SRAM-based, volatile β€”
RoHS Status Compliant [DATA_NEEDED: RoHS compliance status]
Design Tool Quartus II (legacy) / Quartus Prime β€”
Logic Elements β€” 255,000
Logic Cells β€” 255,000
Adaptive Logic Modules (ALMs) β€” approximately 203,200
Maximum User I/Os β€” 488
Core Voltage β€” 1.1 V
Embedded RAM (total) β€” approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks β€” approximately 768 (18x18 multipliers)
Maximum Operating Frequency β€” up to 450 MHz core / 717 MHz per Partstack record
Package β€” 780-ball FC-HFBGA (HBGA)
Operating Temperature β€” -40C to +100C (industrial, 'I' grade)
Mounting Type β€” Surface Mount (BGA)
Configuration Schemes β€” JTAG, Passive Serial, Fast Passive Parallel, Active Serial

Datasheets & Resources

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