EP3SL200H780I4 vs EP3SL200H780C4 Comparison

Detailed side-by-side comparison of EP3SL200H780I4 by Intel and EP3SL200H780C4 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780I4 EP3SL200H780C4
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $6,255.75 $1,210.00
Series Stratix III L Stratix III L
Family Stratix III β€”
Logic Elements (LE) 200,000 β€”
Logic Array Blocks (LABs) 8000 β€”
Embedded Memory Bits 10,901,504 β€”
User I/O Count 488 β€”
DSP Multipliers (18x18) 384 β€”
Voltage - Core Supply 1.1 V β€”
Process Technology 65 nm CMOS β€”
Package Type 780-BBGA / FCBGA (FC-HFBGA) β€”
Package Dimensions 33 mm x 33 mm β€”
Speed Grade I4 (industrial) β€”
Operating Junction Temperature -40C to +100C (industrial) β€”
Configuration Memory SRAM-based, volatile β€”
RoHS Status Compliant Compliant (lead-free)
Design Tool Quartus II (legacy) / Quartus Prime β€”
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements β€” 200,000
Number of LABs/CLBs β€” 8000
Total RAM Bits β€” 10,901,504
Number of I/O β€” 488
Number of Gates β€” [DATA_NEEDED: total gate count not in source data]
Voltage - Supply β€” 0.9 V (core), 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V (I/O)
Operating Temperature β€” 0C to +85C (commercial)
Internal Operating Frequency β€” Up to 800 MHz
Mounting Type β€” Surface Mount
Package / Case β€” 780-BBGA, FCBGA
Supplier Device Package β€” 780-FCBGA
Process Node β€” 40 nm TSMC
Multiplier Count (9-bit) β€” 488
MSL Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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