EP3SL200H780I4L vs EP3SL200H780C4L Comparison

Detailed side-by-side comparison of EP3SL200H780I4L by Intel and EP3SL200H780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780I4L EP3SL200H780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $6,459.35
Family Stratix III L β€”
Logic Elements 200,000 200,000
Logic Array Blocks (LABs) 8,000 β€”
Embedded Memory (Bits) 10,901,504 β€”
Maximum User I/O 488 β€”
Core Supply Voltage 0.86 V to 1.15 V β€”
Process Technology 65 nm CMOS TSMC 40 nm
Internal Performance 375 MHz β€”
Package 780-pin FC-HFBGA (Flip-Chip) β€”
Mounting Type Surface Mount β€”
Operating Temperature -40C to +100C (Industrial) 0C to 85C (commercial)
Transceivers Up to 24 channels β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
DSP Blocks 9x9 / 18x18 / 36x36 multipliers β€”
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II β€”
JTAG Support IEEE Std 1149.1 Boundary-Scan β€”
RoHS Status Compliant Compliant
Speed Grade I4 (Industrial) -4 (medium performance, commercial)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) β€”
Manufacturer β€” Intel (formerly Altera)
Series β€” Stratix III
Device Type β€” FPGA - Field Programmable Gate Array
Embedded Memory β€” 6.5 Mbit
User I/O Count β€” 488
Package Type β€” 780-ball FCBGA (FineLine BGA, HBGA)
Package Code β€” BGA-780 / PBGA780 / HBGA-780
Package Mounting β€” Surface Mount
Internal Logic Frequency β€” up to 717 MHz (per ampheo datasheet brief)
Lead-Free / Pb-Free β€” Yes (L suffix, lead-free)
Configuration Modes β€” FPP, AS, PS, JTAG

Datasheets & Resources

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